- Advanced DSP/DDOV TechnologyEnsures seamless digital signal transmission and precise audio processing.
- Dual Backup DesignSupports hand-in-hand conferencing and phantom power output for redundancy.
- Precision Microphone Design32,500 acoustic holes enhance vocal pickup sensitivity.
- High-Sensitivity PickupAutomatic gain control ensures consistent clarity.
- Shielded CablingCAT5 / 8-core cables eliminate electromagnetic interference.
- Flexible Conference ModesFIFO, LIFO, voice activation, queuing, free discussion and more.
- Magnetic Microphone PoleDual gold-plated condenser capsules for high-quality sound.
- Touch ControlsSilent capacitive keys with long durability.
- Smart ID AddressingSupports integration with speech recognition systems.
CLA-CON20 VAR S – C&D
CLA-CON20 VAR S – C&D
Name
Digital Array Conference Unit
Model
CLA-CON20 VAR S – C&D
This advanced digital array conference unit integrates DSP/DDOV digital processing technology powered by a stable IRIN chip, ensuring precise signal transmission and seamless audio handling. The dual backup design supports both hand-in-hand conferencing and phantom power output, providing robust redundancy.
The microphone stem is engineered with 32,500 high-density acoustic interference holes for superior voice pickup, enhanced further by automatic gain control (AGC). It supports multiple conference modes including FIFO, LIFO, voice activation, and free discussion, making it ideal for dynamic meeting environments.
With magnetic pluggable microphone poles, touch-sensitive controls, and smart digital ID addressing, the system ensures high-fidelity audio capture and seamless integration with speech recognition platforms.
